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Processors

Intel Xeon W-2223 processor 3.6 GHz 8.25 MB

Part Code:

CD8069504394701

Description:

  • Processor socket: LGA 2066 (Socket R4)
  • Box: N
  • Processor cores: 4
  • Processor family: Intel Xeon W
  • Processor lithography: up to 22nm
  • On-board graphics adapter: N
  • Cooler included: N
  • Discrete graphics adapter: N
IntelŪ Turbo Boost Technology IntelŪ Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don™t. IntelŪ vPro Platform Eligibility IntelŪ vPro Technology is a set of security and manageability capabilities built into the processor aimed at addressing four critical areas of IT security: 1) Threat management, including protection from rootkits, viruses, and malware 2) Identity and web site access point protection 3) Confidential personal and business data protection 4) Remote and local monitoring, remediation, and repair of PCs and workstations. IntelŪ Hyper-Threading Technology IntelŪ Hyper-Threading Technology (IntelŪ HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner. IntelŪ Virtualization Technology (VT-x) IntelŪ Virtualization Technology (VT-x) allows one hardware platform to function as multiple œvirtual platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions. IntelŪ Virtualization Technology for Directed I/O (VT-d) IntelŪ Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and ItaniumŪ processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments. IntelŪ VT-x with Extended Page Tables (EPT) IntelŪ VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in IntelŪ Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management. IntelŪ TSX-NI IntelŪ Transactional Synchronization Extensions New Instructions (IntelŪ TSX-NI) are a set of instructions focused on multi-threaded performance scaling. This technology helps make parallel operations more efficient via improved control of locks in software. IntelŪ 64 IntelŪ 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.đ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory. Instruction Set An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel™s instruction set this processor is compatible with. Instruction Set Extensions Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions). # of AVX-512 FMA Units IntelŪ Advanced Vector Extensions 512 (AVX-512), new instruction set extensions, delivering ultra-wide (512-bit) vector operations capabilities, with up to 2 FMAs (Fused Multiply Add instructions), to accelerate performance for your most demanding computational tasks. Idle States Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states. Enhanced Intel SpeedStepŪ Technology Enhanced Intel SpeedStepŪ Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStepŪ Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStepŪ Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery. Thermal Monitoring Technologies Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits. IntelŪ Identity Protection Technology IntelŪ Identity Protection Technology is a built-in security token technology that helps provide a simple, tamper-resistant method for protecting access to your online customer and business data from threats and fraud. IntelŪ IPT provides a hardware-based proof of a unique user™s PC to websites, financial institutions, and network services; providing verification that it is not malware attempting to login. IntelŪ IPT can be a key component in two-factor authentication solutions to protect your information at websites and business log-ins. IntelŪ Speed Shift Technology IntelŪ Speed Shift Technology uses hardware-controlled P-states to deliver dramatically quicker responsiveness with single-threaded, transient (short duration) workloads, such as web browsing, by allowing the processor to more quickly select its best operating frequency and voltage for optimal performance and power efficiency. IntelŪ Deep Learning Boost (IntelŪ DL Boost) A new set of embedded processor technologies designed to accelerate AI deep learning use cases. It extends Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly increases deep learning inference performance over previous generations. IntelŪ Volume Management Device (VMD) IntelŪ Volume Management Device (VMD) provides a common, robust method of hot plug and LED management for NVMe-based solid state drives.
Processor
Processor base frequency3.6 GHz
Processor manufacturerIntel
Cooler includedNo
Processor codenameCascade Lake
Memory bandwidth supported by processor (max)85.3 GB/s
Thermal Design Power (TDP)120 W
Processor cache8.25 MB
Processor ARK ID198018
Processor modelW-2223
Processor threads8
System bus rate8 GT/s
Processor operating modes64-bit
Processor boost frequency3.9 GHz
Component forServer/workstation
Processor lithography14 nm
Processor familyIntel Xeon W
Processor cores4
BoxNo
Processor socketLGA 2066 (Socket R4)
Memory
Maximum internal memory supported by processor1024 GB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2666 MHz
Memory bandwidth supported by processor (max)85.3 GB/s
Supported memory typesDDR4-SDRAM
Memory channelsQuad-channel
ECCYes
Graphics
Discrete graphics adapterNo
On-board graphics adapter modelNot available
On-board graphics adapterNo
Discrete graphics adapter modelNot available
Power
Thermal Design Power (TDP)120 W
Technical details
Intel TSX-NIYes
IntelŪ Secure KeyYes
Thermal Monitoring TechnologiesYes
IntelŪ Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
IntelŪ Identity Protection Technology (IntelŪ IPT)Yes
IntelŪ Hyper Threading Technology (IntelŪ HT Technology)Yes
IntelŪ AES New Instructions (IntelŪ AES-NI)Yes
Idle StatesYes
Execute Disable BitYes
Enhanced Intel SpeedStep TechnologyYes
PCI Express slots version3.0
Supported instruction setsSSE4.2,AVX,AVX 2.0,AVX-512
Scalability1S
Physical Address Extension (PAE)Yes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Demand Based SwitchingYes
Embedded options availableNo
CPU configuration (max)1
Product typeProcessor
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Thermal Design Power (TDP)120 W
Supported memory typesDDR4-SDRAM
StatusLaunched
Physical Address Extension (PAE)46 bit
Market segmentWorkstation
Launch dateQ4'19
Intel Virtualization Technology (VT-x)Yes
AVX-512 Fused Multiply-Add (FMA) units2
Bus speed8 GT/s
Features
Maximum number of PCI Express lanes48
Thermal Design Power (TDP)120 W
Processor package size45mm x 52.5mm
Processor ARK ID198018
Thermal Monitoring TechnologiesYes
Idle StatesYes
Execute Disable BitYes
PCI Express slots version3.0
Supported instruction setsSSE4.2,AVX,AVX 2.0,AVX-512
Scalability1S
Physical Address Extension (PAE)Yes
Embedded options availableNo
CPU configuration (max)1
Physical Address Extension (PAE)46 bit
Market segmentWorkstation
Harmonized System (HS) code8542310001
Export Control Classification Number (ECCN)5A992C
Commodity Classification Automated Tracking System (CCATS)G077159
PCI Express CEM revision3.0
Processor special features
Intel Software Guard Extensions (Intel SGX)No
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Intel Turbo Boost Max Technology 3.0No
IntelŪ Speed Shift TechnologyYes
IntelŪ Memory Protection Extensions (IntelŪ MPX)Yes
IntelŪ Optane Memory ReadyNo
IntelŪ OS GuardYes
Intel TSX-NIYes
IntelŪ Secure KeyYes
IntelŪ Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
IntelŪ Identity Protection Technology (IntelŪ IPT)Yes
IntelŪ Hyper Threading Technology (IntelŪ HT Technology)Yes
IntelŪ AES New Instructions (IntelŪ AES-NI)Yes
Enhanced Intel SpeedStep TechnologyYes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Demand Based SwitchingYes
Intel Virtualization Technology (VT-x)Yes
AVX-512 Fused Multiply-Add (FMA) units2
IntelŪ Boot GuardYes
IntelŪ Volume Management Device (VMD)Yes
IntelŪ Deep Learning Boost (IntelŪ DL Boost)Yes
IntelŪ vPro Platform EligibilityYes
IntelŪ Transactional Synchronization ExtensionsYes
Operational conditions
Tcase64 °C
Packaging data
Package width44 mm
Package depth116 mm
Package height101 mm
Package typeRetail box
Weight & dimensions
Processor package size45mm x 52.5mm
Package width44 mm
Package depth116 mm
Package height101 mm
Other features
Maximum internal memory1000 GB
CPU configuration (max)1
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